Hidden feature for accessing or repairing mobile devices

ABSTRACT

Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.

FIELD

The present disclosure generally relates to the field of electronics.More particularly, an embodiment relates to provision and/or utilizationof a hidden feature for accessing and/or repairing mobile devices.

BACKGROUND

Mobile computing devices are quickly becoming commonplace, e.g., due totheir increased battery life as well as improved computing capabilities.One current trend in tablet (or smartphone) design is to permanentlyseal or bond/glue the display assembly to the chassis. This may minimizethe use of fasteners, holes, and/or screws, and enhance the overallsystem aesthetic. Such design solutions can, however, limit the upgrade,repair, and/or rework potentials for mobile computing devices, e.g.,even in the factory environment.

Some repair toolkits may be used to pry open such devices. However, thetoolkits may require an operator to have prior knowledge about tearingdown such devices, e.g., to ensure no brakeage or damage to the device.

BRIEF DESCRIPTION OF THE DRAWINGS

The detailed description is provided with reference to the accompanyingfigures. In the figures, the left-most digit(s) of a reference numberidentifies the figure in which the reference number first appears. Theuse of the same reference numbers in different figures indicates similaror identical items.

FIG. 1 illustrates an exploded view of a tablet device according to anembodiment.

FIG. 2A illustrates an exploded view of a tablet with an embedded wirestorage portion, according to an embodiment.

FIG. 2B illustrates an exploded view of a tablet with an embedded wireaccess port, according to an embodiment.

FIG. 3 illustrates an exploded view of a tablet with an extracted wire,according to an embodiment.

FIGS. 4A-4C illustrate block diagrams for utilizing various techniquesfor accessing a fastener through an audio jack hole of a computingdevice, according to some embodiments.

FIGS. 5-8 illustrate block diagrams of embodiments of computing systems,which may be utilized to implement various embodiments discussed herein.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth inorder to provide a thorough understanding of various embodiments.However, various embodiments may be practiced without the specificdetails. In other instances, well-known methods, procedures, components,and circuits have not been described in detail so as not to obscure theparticular embodiments. Further, various aspects of embodiments may beperformed using various means, such as integrated semiconductor circuits(“hardware”), computer-readable instructions organized into one or moreprograms (“software”), or some combination of hardware and software. Forthe purposes of this disclosure reference to “logic” shall mean eitherhardware, software, firmware, or some combination thereof.

As mentioned above, some current solutions may require specialized toolssuch as prying tools, a spudger (also referred to as a spludger), heatpads, a heat gun, a suction cup, etc. An operator may have to use acombination of these specialized tools to separate a display assemblyfrom the chassis. The results can be inconsistent, and may have an addedrisk of causing damage to the chassis housing or crack the displayassembly. By contrast, some embodiments provide a consistent solution toaccess and/or repair a mobile computing device and reduce potentialdamage to the device while still avoiding the use of fasteners, etc.that may affect the aesthetic of the device.

More particularly, some embodiments provide techniques for provisionand/or utilization of a hidden feature for accessing and/or repairingmobile devices. In various embodiments, techniques discussed herein maybe applied to different computing systems (such as those discussed withreference to FIGS. 5-8), including mobile computing device(s) (forexample, a smartphone, tablet, UMPC (Ultra-Mobile Personal Computer),laptop computer, Ultrabook™ computing device, wearable device (such as asmart watch, smart glasses, a smart bracelet, and the like), etc.,and/or non-mobile computing devices including a desktop computer,workstation, computer server (such as a blade server), etc.

For instance, a tablet (or another type of computing device includingthose mentioned above) can be sealed using adhesive (or other bondingmaterial) that is provided between the display assembly and the chassis.One embodiment provides/utilizes an embedded wire below the adhesivelayer (or otherwise physically adjacent to the adhesive or bonding layerused for assembly of the a computing device). When a device needs to beopened/accessed, the embedded wire is heated to effectively cut throughthe layer of adhesive or bonding material to separate the displayassembly (e.g., including a flat panel display device) from the chassis(or device cover). This provides a consistent solution (e.g., ascontrasted to existing solutions discussed above such as prying, etc.),and also reduces or eliminates any potential damage to the device whilestill avoiding the use of fasteners, etc.

In another embodiment, a fastening device (e.g., a pin, button, screw,shaft, or combinations thereof, etc.) is hidden behind the audio jackhole (which is already available in most if not all mobile computingdevices). This will allow the mobile device to have seamless look, whilestill being serviceability, upgradeable, and/or reworkable in productionor in the field via the hidden feature. Hence, some embodiments provideseamless access for opening/accessing a product, e.g., for service,upgrade, debug, reworking, etc.

FIG. 1 illustrates an exploded view of a tablet device according to anembodiment. As previously mentioned, embodiments discussed herein arenot limited to tablets and may applied to different types of computingsystems (such as those discussed with reference to FIGS. 5-8), includingmobile computing device(s) (for example, a smartphone, UMPC(Ultra-Mobile Personal Computer), laptop computer, Ultrabook™ computingdevice, wearable device (such as a smart watch, smart glasses, a smartbracelet, and the like), etc., and/or non-mobile computing devicesincluding a desktop computer, workstation, computer server (such as ablade server), etc.

Referring to FIG. 1, a display assembly is attached (e.g., bonded withadhesive 120 or other material) to a device chassis (or tablet cover 130in the example shown). An embedded wire 150 is provided physicaladjacent to the adhesive 120 (e.g., between the tablet cover 130 andadhesive 120 as shown, or could be between the display assembly 110 andthe adhesive 120 (not shown), or both). The shell/channel holding theembedded wire 150 may be made of metal or other heat resistant materialsuch as heat resistant plastic.

In an embodiment, the embedded wire 150 may be any type of wire that iscapable of sustaining a sufficient amount of heat (or temperature) for asufficient duration to effectively cut through the layer of adhesive (orbonding material). The embedded wire may be heated by applyingelectrical voltage (and/or electrical current) to the wire. The embeddedwire may be selected such that shrinkage of the embedded wire (e.g., dueto the heat generated in the embedded wire) is limited to about fourpercent (4%) of its length in some embodiments. As an example, theembedded wire may include one or more of: Nichrome™ wire (or a (e.g.,non-magnetic) alloy of nickel, chromium, and optionally iron), Nitinol™(or an alloy of Nickle and Titanium) wire, nickel (or nickel alloy)wire, cooper (or copper alloy) wire, aluminum (or aluminum alloy) wire,silver (or silver alloy) wire, combinations thereof (e.g., where theembedded wire may include different portions consisting of differentmaterial such as the aforementioned material), or alloys thereof.

FIG. 2A illustrates an exploded view of a tablet with an embedded wirestorage portion, according to an embodiment. FIG. 2B illustrates anexploded view of a tablet with an embedded wire access port, accordingto an embodiment (e.g., without distraction to the tablet identitylook). As previously mentioned, embodiments discussed herein are notlimited to tablets and may applied to different types of computingsystems (such as those discussed with reference to FIGS. 5-8), includingmobile computing device(s) (for example, a smartphone, UMPC(Ultra-Mobile Personal Computer), laptop computer, Ultrabook™ computingdevice, wearable device (such as a smart watch, smart glasses, a smartbracelet, and the like), etc., and/or non-mobile computing devicesincluding a desktop computer, workstation, computer server (such as ablade server), etc.

Referring to FIG. 2A, at least one (e.g., coiled) end of the embeddedwire may be hidden in a storage pocket 202. Even though FIG. 2Aillustrates an end of the embedded wire 150 being stored in the storagepocket 202, embodiments are not limited to this and any portion of thewire (e.g., a middle portion) of the embedded wire may be stored in thestorage pocket as well. Hence, the embedded wire is first fished out (orotherwise extracted) from the storage pocket prior to heating (orapplication of voltage or current). Such embodiments allow for finishedsystems to be easily accessed, repaired, debugged, reworked, upgraded,etc.; hence, reducing the impact to their environmental footprint and/orwithout affecting the aesthetic of such devices. Referring to FIG. 2B, awire port 204 is shown which inconspicuously embeds the wire 150 in atablet (e.g., to be extracted for access to the wire and application ofheat, etc.).

FIG. 3 illustrates an exploded view of a tablet with an extracted wire,according to an embodiment. As previously mentioned, embodimentsdiscussed herein are not limited to tablets and may applied to differenttypes of computing systems (such as those discussed with reference toFIGS. 5-8), including mobile computing device(s) (for example, asmartphone, UMPC (Ultra-Mobile Personal Computer), laptop computer,Ultrabook™ computing device, wearable device (such as a smart watch,smart glasses, a smart bracelet, and the like), etc., and/or non-mobilecomputing devices including a desktop computer, workstation, computerserver (such as a blade server), etc. Referring to FIG. 3, the embeddedwire 150 is extracted and ready for application of heat (e.g., viaapplication of electrical voltage and/or current) to separate thedisplay assembly from the chassis.

FIGS. 4A-4C illustrate block diagrams for utilizing various techniquesfor accessing a fastening device (or a fastener) through an audio jackhole of a computing device, according to some embodiments. Utilizing theaudio jack hole 404 may allow for access to open/close a product, hidethe access area/port/part, reduce or eliminate the need for use of glue(or other bonding material) to close a device enclosure. Moreover, apin, button, screw, shaft, or other types of a fastener, etc. is hiddenbehind the audio jack hole 404 (which is already available in most ifnot all mobile computing devices). This will allow the mobile device tohave seamless look, while still being serviceability, upgradeable,and/or reworkable in production or in the field via the hidden feature.Hence, some embodiments provide seamless access for opening/accessing aproduct, e.g., for service, upgrade, debug, reworking, etc.

While some embodiments are discussed herein with reference to the audiojack hole 404, other opening (or hole, e.g., with or without a cover orplug) may be used for this hidden feature. In an embodiment, apre-existing hole or opening is used, e.g., to reduce manufacturingcosts. As an example, the hidden feature may be implemented behind alocking pin or locking hole, a data communication port (such as anetwork, phone, etc. port). To hide the fastening device, it may becoupled at a first end of an opening (or hole) in a computing device,where the second end of the opening (or hole) is open such that a toolmay be inserted from the second end to engage the fastening device. Thiscan be done while the hole or opening retains its original purpose,e.g., to provide an audio signal communication, security locking, ordata signal communication functionality. In an embodiment, the length ofthis hole between the first end and the second end may be relativelylonger than its width at the first or second ends to effectively hidethe fastening device.

More particularly, FIG. 4A shows how a tool may be applied via an audiojack hole 404 to access the system through one or more pins that lockthe LCD (Liquid Crystal Display, or more generally a flat panel display)with the Structure Frame (SF). FIG. 4B shows how a tool may be appliedvia the audio jack hole 404 to access the system through a button shaft(e.g., with one or more hooks and/or spring) that locks the LCD with thestructure frame. For example, foam may be provided between the buttonand the tool (such as shown in FIG. 4B) to physically isolate the buttonmovement (and/or for making the computing device water resistant orwater proof). Also, a spring (such as the one shown) may be optionallyprovided to allow for automatic retraction of the button when the buttonis depressed by the tool.

FIG. 4C shows how a tool (such as a screw driver) may be applied via theaudio jack hole 404 to access the system through a shaft screw (e.g.,which may have other types of engagement also such as those discussedwith reference to FIGS. 4A and/or 4B) that to lock or fasten the LCDwith the structure frame. Hence, the mechanisms discussed with referenceto FIGS. 4A-4C are hidden, so they not require any additional holes onthe computing device. Also, these mechanisms may be used to water sealthe hole (e.g., audio jack hole or the lock pin hole).

Some embodiments may be applied in computing systems that include one ormore processors (e.g., with one or more processor cores), such as thosediscussed with reference to FIGS. 5-8, including for example mobilecomputing devices such as a smartphone, tablet, UMPC (Ultra-MobilePersonal Computer), laptop computer, Ultrabook™ computing device,wearable devices (such as smart watch, smart glasses, smart bracelets,and the like), etc. More particularly, FIG. 5 illustrates a blockdiagram of a computing system 500, according to an embodiment. As shown,system 500 may include the embedded wire 150, audio logic 520 (e.g., tofacilitate audio features), audio jack 402, and/or access (or audio jackhole) 404.

System 500 may include one or more processors 502-1 through 502-N(generally referred to herein as “processors 502” or “processor 502”).The processors 502 may be general-purpose CPUs (Central ProcessingUnits) and/or GPUs (Graphics Processing Units) in various embodiments.The processors 502 may communicate via an interconnection or bus 504.Each processor may include various components some of which are onlydiscussed with reference to processor 502-1 for clarity. Accordingly,each of the remaining processors 502-2 through 502-N may include thesame or similar components discussed with reference to the processor502-1.

In an embodiment, the processor 502-1 may include one or more processorcores 506-1 through 506-M (referred to herein as “cores 506,” or “core506”), a cache 508, and/or a router 510. The processor cores 506 may beimplemented on a single integrated circuit (IC) chip. Moreover, the chipmay include one or more shared and/or private caches (such as cache508), buses or interconnections (such as a bus or interconnection 512),graphics and/or memory controllers (such as those discussed withreference to FIGS. 6-8), or other components.

In one embodiment, the router 510 may be used to communicate betweenvarious components of the processor 502-1 and/or system 500. Moreover,the processor 502-1 may include more than one router 510. Furthermore,the multitude of routers 510 may be in communication to enable datarouting between various components inside or outside of the processor502-1.

The cache 508 may store data (e.g., including instructions) that areutilized by one or more components of the processor 502-1, such as thecores 506. For example, the cache 508 may locally cache data stored in amemory 514 for faster access by the components of the processor 502(e.g., faster access by cores 506). As shown in FIG. 5, the memory 514may communicate with the processors 502 via the interconnection 504. Inan embodiment, the cache 508 (that may be shared) may be a mid-levelcache (MLC), a last level cache (LLC), etc. Also, each of the cores 506may include a Level 1 (L1) cache (516-1) (generally referred to hereinas “L1 cache 516”) or other levels of cache such as a Level 2 (L2)cache. Moreover, various components of the processor 502-1 maycommunicate with the cache 508 directly, through a bus (e.g., the bus512), and/or a memory controller or hub.

FIG. 6 illustrates a block diagram of a computing system 600 inaccordance with an embodiment. As shown, system 600 may include theembedded wire 150, audio jack 402, and/or access (or audio jack hole)404. Computing system 600 may include one or more Central ProcessingUnits (CPUs) 602 or processors that communicate via an interconnectionnetwork (or bus) 604. The processors 602 may include a general purposeprocessor, a network processor (that processes data communicated over acomputer network 603), or other types of a processor (including areduced instruction set computer (RISC) processor or a complexinstruction set computer (CISC)).

Moreover, the processors 602 may have a single or multiple core design.The processors 602 with a multiple core design may integrate differenttypes of processor cores on the same integrated circuit (IC) die. Also,the processors 602 with a multiple core design may be implemented assymmetrical or asymmetrical multiprocessors. In an embodiment, one ormore of the processors 602 may be the same or similar to the processors502 of FIG. 5. Also, the operations discussed with reference to FIGS.1-5 may be performed by one or more components of the system 600.

A chipset 606 may also communicate with the interconnection network 604.The chipset 606 may include a graphics memory control hub (GMCH) 608,which may be located in various components of system 600 (such as thoseshown in FIG. 6). The GMCH 608 may include a memory controller 610 thatcommunicates with a memory 612 (which may be the same or similar to thememory 514 of FIG. 5). The memory 612 may store data, includingsequences of instructions, that may be executed by the CPU 602, or anyother device included in the computing system 600. In one embodiment,the memory 612 may include one or more volatile storage (or memory)devices such as random access memory (RAM), dynamic RAM (DRAM),synchronous DRAM (SDRAM), static RAM (SRAM), or other types of storagedevices. Nonvolatile memory may also be utilized such as a hard disk.Additional devices may communicate via the interconnection network 604,such as multiple CPUs and/or multiple system memories.

The GMCH 608 may also include a graphics interface 614 that communicateswith the display device. In one embodiment, the graphics interface 614may communicate with a display device via an accelerated graphics port(AGP) or Peripheral Component Interconnect (PCI) (or PCI express (PCIe)interface). In an embodiment, the display (such as a flat panel display)may communicate with the graphics interface 614 through, for example, asignal converter that translates a digital representation of an imagestored in a storage device such as video memory or system memory intodisplay signals that are interpreted and displayed by the displaydevice. The display signals produced by the display device may passthrough various control devices before being interpreted by andsubsequently displayed on the display device.

A hub interface 618 may allow the GMCH 608 and an input/output controlhub (ICH) 620 to communicate. The ICH 620 may provide an interface toI/O device(s) that communicate with the computing system 600. The ICH620 may communicate with a bus 622 through a peripheral bridge (orcontroller) 624, such as a peripheral component interconnect (PCI)bridge, a universal serial bus (USB) controller, or other types ofperipheral bridges or controllers. The bridge 624 may provide a datapath between the CPU 602 and peripheral devices. Other types oftopologies may be utilized. Also, multiple buses may communicate withthe ICH 620, e.g., through multiple bridges or controllers. Moreover,other peripherals in communication with the ICH 620 may include, invarious embodiments, integrated drive electronics (IDE) or smallcomputer system interface (SCSI) hard drive(s), USB port(s), a keyboard,a mouse, parallel port(s), serial port(s), floppy disk drive(s), digitaloutput support (e.g., digital video interface (DVI)), or other devices.

The bus 622 may communicate with an audio device 626, one or more diskdrive(s) 628, and a network interface device 630 (which is incommunication with the computer network 603). Other devices maycommunicate via the bus 622. As shown, the network interface device 630may be coupled to an antenna 631 to wirelessly (e.g., via an Instituteof Electrical and Electronics Engineers (IEEE) 802.11 interface(including IEEE 802.11a/b/g/n/ac, etc.), cellular interface, 3G, 5G,LPE, etc.) communicate with the network 603. Other devices maycommunicate via the bus 622. Also, various components (such as thenetwork interface device 630) may communicate with the GMCH 608. Inaddition, the processor 602 and the GMCH 608 may be combined to form asingle chip. Furthermore, a graphics accelerator may be included withinthe GMCH 608 in other embodiments.

Furthermore, the computing system 600 may include volatile and/ornonvolatile memory (or storage). For example, nonvolatile memory mayinclude one or more of the following: read-only memory (ROM),programmable ROM (PROM), erasable PROM (EPROM), electrically EPROM(EEPROM), a disk drive (e.g., 628), a floppy disk, a compact disk ROM(CD-ROM), a digital versatile disk (DVD), flash memory, amagneto-optical disk, or other types of nonvolatile machine-readablemedia that are capable of storing electronic data (e.g., includinginstructions).

FIG. 7 illustrates a computing system 700 that is arranged in apoint-to-point (PtP) configuration, according to an embodiment. Inparticular, FIG. 7 shows a system where processors, memory, andinput/output devices are interconnected by a number of point-to-pointinterfaces. The operations discussed with reference to FIGS. 1-6 may beperformed by one or more components of the system 700. As shown, system700 may include the embedded wire 150, audio jack 402, and/or access (oraudio jack hole) 404

As illustrated in FIG. 7, the system 700 may include several processors,of which only two, processors 702 and 704 are shown for clarity. Theprocessors 702 and 704 may each include a local memory controller hub(MCH) 706 and 708 to enable communication with memories 710 and 712. Thememories 710 and/or 712 may store various data such as those discussedwith reference to the memory 612 of FIG. 6.

In an embodiment, the processors 702 and 704 may be one of theprocessors 602 discussed with reference to FIG. 6. The processors 702and 704 may exchange data via a point-to-point (PtP) interface 714 usingPtP interface circuits 716 and 718, respectively. Also, the processors702 and 704 may each exchange data with a chipset 720 via individual PtPinterfaces 722 and 724 using point-to-point interface circuits 726, 728,730, and 732. The chipset 720 may further exchange data with a graphicscircuit 734 via a graphics interface 736, e.g., using a PtP interfacecircuit 737.

The chipset 720 may communicate with a bus 740 using a PtP interfacecircuit 741. The bus 740 may communicate with one or more devices, suchas a bus bridge 742 and I/O devices 743. Via a bus 744, the bus bridge742 may communicate with other devices such as a keyboard/mouse 745,communication devices 746 (such as modems, network interface devices, orother communication devices that may communicate with the computernetwork 603), audio I/O device 747, and/or a data storage device 748.The data storage device 748 may store code 749 that may be executed bythe processors 702 and/or 704.

In some embodiments, one or more of the components discussed herein canbe embodied as a System On Chip (SOC) device. FIG. 8 illustrates a blockdiagram of an SOC package in accordance with an embodiment. Asillustrated in FIG. 8, SOC 802 includes one or more Central ProcessingUnit (CPU) cores 820, one or more Graphics Processing Unit (GPU) cores830, an Input/Output (I/O) interface 840, and a memory controller 842.Various components of the SOC package 802 may be coupled to aninterconnect or bus such as discussed herein with reference to the otherfigures. Also, the SOC package 802 may include more or less components,such as those discussed herein with reference to the other figures.Further, each component of the SOC package 820 may include one or moreother components, e.g., as discussed with reference to the other figuresherein. In one embodiment, SOC package 802 (and its components) isprovided on one or more Integrated Circuit (IC) die, e.g., which arepackaged into a single semiconductor device.

As illustrated in FIG. 8, SOC package 802 is coupled to a memory 860(which may be similar to or the same as memory discussed herein withreference to the other figures) via the memory controller 842. In anembodiment, the memory 860 (or a portion of it) can be integrated on theSOC package 802.

The I/O interface 840 may be coupled to one or more I/O devices 870,e.g., via an interconnect and/or bus such as discussed herein withreference to other figures. I/O device(s) 870 may include one or more ofa keyboard, a mouse, a touchpad, a display device, an image/videocapture device (such as a camera or camcorder/video recorder), a touchscreen, a speaker, or the like. Furthermore, As shown, the system ofFIG. 8 may include the embedded wire 150, audio jack 402, and/or access(or audio jack hole) 404. Also,

Moreover, the scenes, images, or frames discussed herein (e.g., whichmay be processed by the graphics logic in various embodiments) may becaptured by an image capture device (such as a digital camera (that maybe embedded in another device such as a smart phone, a tablet, a laptop,a stand-alone camera, etc.) or an analog device whose captured imagesare subsequently converted to digital form). Moreover, the image capturedevice may be capable of capturing multiple frames in an embodiment.Further, one or more of the frames in the scene are designed/generatedon a computer in some embodiments. Also, one or more of the frames ofthe scene may be presented via a display (such as the display discussedwith reference to FIGS. 6 and/or 7, including for example a flat paneldisplay device, etc.).

The following examples pertain to further embodiments. Example 1includes 1 includes an apparatus comprising: a wire physically adjacentto an adhesive, wherein the adhesive is to bond a first portion of acomputing device and a second portion of the computing device, whereinthe wire is capable to be heated in response to application ofelectrical voltage or current, wherein the heated wire is to causecutting of the adhesive to allow for physical separation of the firstportion of the computing device and the second portion of the computingdevice. Example 2 includes the apparatus of example 1, wherein the wireis to comprise one or more of: Nichrome wire, Nitinol wire, nickel ornickel alloy wire, cooper or copper alloy wire, aluminum or aluminumalloy wire, silver or silver alloy) wire, or alloys thereof. Example 3includes the apparatus of example 1, wherein the wire is capable ofsustaining a sufficient amount of heat or temperature for a sufficientduration to effectively cut through the adhesive. Example 4 includes theapparatus of example 1, wherein shrinkage of the wire, due to theapplication of the electrical voltage or current, is limited to aboutfour percent of its length. Example 5 includes the apparatus of example1, further comprising a pocket to store a portion of the wire. Example 6includes the apparatus of example 1, wherein the first portion of thecomputing device is to comprise a display assembly. Example 7 includesthe apparatus of example 6, wherein the display assembly is to comprisea flat panel display. Example 8 includes the apparatus of example 1,wherein the second portion of the computing device is to comprise adevice chassis or a device cover. Example 9 includes the apparatus ofexample 1, wherein the computing device is to comprise a mobilecomputing device. Example 10 includes the apparatus of example 9,wherein the mobile computing device is to comprise one or more of: aSystem On Chip (SOC) device; a processor, having one or more processorcores; a flat panel display device, and memory. Example 11 includes theapparatus of example 9, wherein the mobile computing device is tocomprise one of: a smartphone, tablet, UMPC (Ultra-Mobile PersonalComputer), laptop computer, Ultrabook™ computing device, and a wearabledevice. Example 12 includes the apparatus of example 11, wherein thewearable device is to comprise one of a smart watch, smart glasses, or asmart bracelet.

Example 13 includes an apparatus comprising: a fastening device coupledto a first end of an opening in a computing device, wherein thefastening device is to be accessible from a second end of the openingwhile the opening retains its original functionality, wherein thefastening device is to couple a first portion of the computing deviceand a second portion of the computing device. Example 14 includes theapparatus of example 13, wherein the fastening device is to comprise: apin, button, screw, shaft, or combinations thereof. Example 15 includesthe apparatus of example 13, wherein the second end of the opening is onan opposite end of the opening from the first end of the opening.Example 16 includes the apparatus of example 13, wherein the originalfunctionality is to comprise an audio signal communicationfunctionality, a data communication functionality, or security lockingfunctionality. Example 17 includes the apparatus of example 13, whereinthe first portion of the computing device is to comprise a displayassembly. Example 18 includes the apparatus of example 17, wherein thedisplay assembly is to comprise a flat panel display. Example 19includes the apparatus of example 13, wherein the second portion of thecomputing device is to comprise a device chassis or a device cover.Example 20 includes the apparatus of example 13, wherein the computingdevice is to comprise a mobile computing device. Example 21 includes theapparatus of example 20, wherein the mobile computing device is tocomprise one or more of: a System On Chip (SOC) device; a processor,having one or more processor cores; a flat panel display device, andmemory. Example 22 includes the apparatus of example 20, wherein themobile computing device is to comprise one of: a smartphone, tablet,UMPC (Ultra-Mobile Personal Computer), laptop computer, Ultrabook™computing device, and a wearable device. Example 23 includes theapparatus of example 22, wherein the wearable device is to comprise oneof a smart watch, smart glasses, or a smart bracelet.

Example 24 includes a computing system comprising: a processor havingone or more processor cores; and a wire physically adjacent to anadhesive, wherein the adhesive is to bond a first portion of thecomputing system and a second portion of the computing system, whereinthe wire is capable to be heated in response to application ofelectrical voltage or current, wherein the heated wire is to causecutting of the adhesive to allow for physical separation of the firstportion of the computing system and the second portion of the computingsystem. Example 25 includes the system of example 24, wherein the wireis to comprise one or more of: Nichrome wire, Nitinol wire, nickel ornickel alloy wire, cooper or copper alloy wire, aluminum or aluminumalloy wire, silver or silver alloy) wire, or alloys thereof. Example 26includes the system of example 24, wherein the wire is capable ofsustaining a sufficient amount of heat or temperature for a sufficientduration to effectively cut through the adhesive.

Example 27 includes a computing system comprising: a processor havingone or more processor cores; and a fastening device coupled to a firstend of an opening in the computing system, wherein the fastening deviceis to be accessible from a second end of the opening while the openingretains its original functionality, wherein the fastening device is tocouple a first portion of the computing system and a second portion ofthe computing system. Example 28 includes the system of example 27,wherein the fastening device is to comprise: a pin, button, screw,shaft, or combinations thereof. Example 29 includes the system ofexample 27, wherein the second end of the opening is on an opposite endof the opening from the first end of the opening. Example 30 includes anapparatus comprising means to perform a method as set forth in anypreceding example.

In various embodiments, the operations discussed herein, e.g., withreference to FIGS. 1-8, may be implemented as hardware (e.g., logiccircuitry), software, firmware, or combinations thereof, which may beprovided as a computer program product, e.g., including a tangible(e.g., non-transitory) machine-readable or computer-readable mediumhaving stored thereon instructions (or software procedures) used toprogram a computer to perform a process discussed herein. Themachine-readable medium may include a storage device such as thosediscussed with respect to FIGS. 1-8.

Additionally, such computer-readable media may be downloaded as acomputer program product, wherein the program may be transferred from aremote computer (e.g., a server) to a requesting computer (e.g., aclient) by way of data signals provided in a carrier wave or otherpropagation medium via a communication link (e.g., a bus, a modem, or anetwork connection).

Reference in the specification to “one embodiment” or “an embodiment”means that a particular feature, structure, and/or characteristicdescribed in connection with the embodiment may be included in at leastan implementation. The appearances of the phrase “in one embodiment” invarious places in the specification may or may not be all referring tothe same embodiment.

Also, in the description and claims, the terms “coupled” and“connected,” along with their derivatives, may be used. In someembodiments, “connected” may be used to indicate that two or moreelements are in direct physical or electrical contact with each other.“Coupled” may mean that two or more elements are in direct physical orelectrical contact. However, “coupled” may also mean that two or moreelements may not be in direct contact with each other, but may stillcooperate or interact with each other.

Thus, although embodiments have been described in language specific tostructural features and/or methodological acts, it is to be understoodthat claimed subject matter may not be limited to the specific featuresor acts described. Rather, the specific features and acts are disclosedas sample forms of implementing the claimed subject matter.

The invention claimed is:
 1. An apparatus comprising: a wire directlydisposed on a portion of a chassis of a computing device; an adhesivedirectly disposed on the wire; a display assembly directly disposed onthe adhesive; wherein the wire is capable to be heated in response toapplication of electrical voltage or current, wherein the heated wire isto cause cutting of the adhesive to allow for physical separation of thedisplay assembly from the chassis, wherein the computing device chassiscomprises an opening to access the wire.
 2. The apparatus of claim 1,wherein the wire is to comprise one or more of: a non-magnetic alloy ofnickel, an alloy comprising nickel and titanium, nickel or nickel alloywire, copper or copper alloy wire, aluminum or aluminum alloy wire,silver or silver alloy) wire, or alloys thereof.
 3. The apparatus ofclaim 1, wherein the wire is capable of sustaining a sufficient amountof heat or temperature for a sufficient duration to effectively cutthrough the adhesive.
 4. The apparatus of claim 1, wherein shrinkage ofthe wire, due to the application of the electrical voltage or current,is limited to about four percent of its length.
 5. The apparatus ofclaim 1, wherein the chassis comprises a pocket to store a portion ofthe wire.
 6. The apparatus of claim 1, wherein the display assembly isto comprise a flat panel display.
 7. The apparatus of claim 1, whereinthe computing device is to comprise a mobile computing device.
 8. Theapparatus of claim 7, wherein the mobile computing device is to compriseone or more of: a System On Chip (SOC) device; a processor, having oneor more processor cores; a flat panel display device, and memory.
 9. Theapparatus of claim 7, wherein the mobile computing device is to compriseone of: a smartphone, tablet, UMPC (Ultra-Mobile Personal Computer), anda laptop computer.
 10. The apparatus of claim 7, wherein the mobilecomputing device comprises a wearable device, wherein the wearabledevice comprises one of a smart watch, smart glasses, or a smartbracelet.